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Bernoulli Chuck - List of Manufacturers, Suppliers, Companies and Products

Bernoulli Chuck Product List

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Bernoulli chuck with vertical gas jet method

Bernoulli chuck with vertical gas jet method

Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.

The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.

  • Wafer
  • CVD Equipment
  • Articulated Robot

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Micro Lens Bernoulli Chuck

Micro Lens Bernoulli Chuck

Transporting micro lenses non-contact.

We will suspend and transport micro lenses for camera-equipped mobile phones, digital cameras, medical cameras, and industrial compact cameras in a non-contact state, floating in the air. No scratches or dirt will be attached.

  • lens

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Gas vertical jet type Bernoulli chuck "Float chuck SAC type"

Gas vertical jet type Bernoulli chuck "Float chuck SAC type"

Bernoulli chuck "Float Chuck SAC type" adopting a gas vertical jet method that reduces airflow friction loss.

We will manufacture custom-made Bernoulli chuck systems and non-contact transport devices using the Bernoulli chuck "Float Chuck SAC type," developed through inventions at the Solar Research Institute, based on our extensive delivery track record. - Non-contact transport device for wafers - Non-contact transport device for glass substrates - Non-contact tweezers - Non-contact transport device for solar cell wafers - Non-contact transport device for wafer chips - Non-contact transport device for lenses - Non-contact transport device for films - Non-contact transport device for printed circuit boards and FPC - Non-contact transport device for non-woven fabrics - High-precision inspection table with air levitation - Sheet feeding device

  • Wafer
  • Other semiconductor manufacturing equipment
  • Wafer

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Bernoulli Chuck for Soft Contact Lenses

Bernoulli Chuck for Soft Contact Lenses

I will transport the wet soft contact lenses.

We transport water-containing soft contact lenses. The "soft contact lens transfer device" uses air ejection to create negative pressure through the ejector effect, Bernoulli effect, and Coanda effect for lens suction grip, and generates positive pressure through a pressure chamber air action effect to release the lens, balancing the gripping contact force to gently hold and transport the contact lenses. All operations are performed using the action of airflow, ensuring that the flexible contact lenses are transported without damage.

  • Other conveying machines
  • Conveyor
  • Transport and handling robots

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Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.

Super fine 1.4mm x 55mm ultra-thin long work Bernoulli chuck.

A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.

New method for non-contact suction of ultra-fine and long workpieces: Adoption of the vertical gas jet method (VGF method). The Bernoulli chuck "Float Chuck SA-CL series" has newly adopted the vertical gas jet method (VGFS) to efficiently suction ultra-fine and long workpieces. The vertical gas jet method reduces friction loss of the gas flow in the cushion chamber by vertically jetting the gas flow emitted from the nozzle, enhancing the effect of negative pressure generation, significantly increasing the suspension capability compared to conventional types, thereby improving the holding stability and resistance to impact, while nearly halving gas consumption.

  • Wafer processing/polishing equipment
  • Wafer
  • Separation device

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Lens Bernoulli chuck corresponding to lenses with different curvatures.

Lens Bernoulli chuck corresponding to lenses with different curvatures.

Compatible with lenses of a wide range of curvature using a Bernoulli chuck for one model of lens.

"The lens Bernoulli chuck corresponding to lenses with different curvatures" utilizes the negative pressure generation effect from the ejector effect and Bernoulli effect by blowing air, as well as the positive pressure generation effect from the pressure chamber type air cushion effect and airflow cushion effect, to suspend and transport concave and convex lenses with different curvatures in a non-contact state in the air. This prevents scratches and dirt on the lens surface and also helps to prevent dust generation. Additionally, there is no need to change models based on lens curvature, significantly improving productivity and allowing for cost-effective equipment proposals. ◎ Features 1. Can suspend and hold without contacting the surface of the lens or sphere. 2. Does not allow scratches or dirt to adhere. 3. Capable of handling a wide range of lens curvatures with a single model. 4. Good holding stability. ◎ Applications 1. Convex and concave lenses 2. Spheres 3. Lenses for optical discs 4. Aspherical lenses 5. Contact lenses

  • Wafer
  • Pneumatic Equipment
  • Other machine elements

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Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

Small Bernoulli chuck for 5mm square wafers compatible with clean rooms.

Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.

At Solar Research Institute, we have developed a "cleanroom-compatible small Bernoulli chuck" that non-contactly chucks and transports micro-work chips measuring 5.0 mm square and smaller. This device generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through a pressure-type air cushion effect, allowing small cut wafer chips to be chucked in a non-contact state, floating in the air, and transported to a designated location. As part of this new mechanism, we have established a circuit to change the exhaust path around the suction pad, allowing for the alteration of the exhaust direction. Therefore, the exhaust does not blow away surrounding chips.

  • Wafer
  • CVD Equipment
  • Wafer processing/polishing equipment

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Bernoulli chuck (contact type)

Bernoulli chuck (contact type)

Bernoulli chuck compatible with warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warpage amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli effect is used to suction the workpiece against the substrate. To prevent shifting during transport, it is held in place by the frictional force of friction rubber. The chuck side makes contact, but it can be used interchangeably for different wafer sizes (note that this may not be possible depending on the combination), allowing for a thinner chuck compared to non-contact types. Since the suction is based on Bernoulli's principle, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers.

  • Other semiconductor manufacturing equipment

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Bernoulli chuck (non-contact type)

Bernoulli chuck (non-contact type)

This is a Bernoulli chuck designed for warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped wafers and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warp amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli force attracts the workpiece to the substrate. To prevent shifting during transport, guides at the edge limit displacement. It levitates without contact except at the edges. One chuck is designed for one size of wafer. Since the attracting force is due to Bernoulli, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers. Additionally, it is non-contact on both sides, making it effective for wafers that cannot be contacted.

  • Other semiconductor manufacturing equipment

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Non-contact wafer transport Bernoulli chuck BC-K series

Non-contact wafer transport Bernoulli chuck BC-K series

Transporting 2 to 12-inch wafers laid flat, gently carried with air cushioning.

The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inches, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There are patterns printed on both sides, accommodating wafers that are 50µm thin and difficult to handle. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.

  • Other conveying machines

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